{"title":"Microwave module packaging","authors":"G. Jerinic, M. Borkowski","doi":"10.1109/MWSYM.1992.188298","DOIUrl":null,"url":null,"abstract":"The demonstration of a $50 package for GaAs MMIC (monolithic microwave integrated circuit) microwave module applications has not been achieved yet. The authors outline the requirements for microwave packaging and describe three low-cost metal-package solutions: (1) brazed construction, (2) metal injection molded construction, and (3) pressure infiltration casting. It is concluded that housing costs that are less than $50 for large quantities can be achieved. If minimum weight is not an essential requirement, a 10-20% cost savings appears to be possible.<<ETX>>","PeriodicalId":165665,"journal":{"name":"1992 IEEE Microwave Symposium Digest MTT-S","volume":"62 11","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1992-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1992 IEEE Microwave Symposium Digest MTT-S","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MWSYM.1992.188298","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
The demonstration of a $50 package for GaAs MMIC (monolithic microwave integrated circuit) microwave module applications has not been achieved yet. The authors outline the requirements for microwave packaging and describe three low-cost metal-package solutions: (1) brazed construction, (2) metal injection molded construction, and (3) pressure infiltration casting. It is concluded that housing costs that are less than $50 for large quantities can be achieved. If minimum weight is not an essential requirement, a 10-20% cost savings appears to be possible.<>
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
