Ziren Wang, Jinchun Gao, H. M. Bilal, Jiahao Luo, Xiaoming Li
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引用次数: 7
Abstract
The transmission loss of the signal in the radio frequency circuit has gained much more attention. In this paper, the loss of the impedance discontinuity caused by the solder joint was mainly investigated and two compensation schemes were proposed. Then, the SMP RF connector and microstrip line models were established in 3D electromagnetic field simulation software, and the S parameters and time domain reflectometry (TDR) before and after compensation were compared. Finally, the S parameters of SMP RF connector and microstrip line before and after the compensation were measured. Both the simulation and the measurement show that the signal integrity and transmission performance of compensated RF connector and microstrip line has been significantly improved.
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