Folded Y-junction in substrate-integrated waveguide technology

Cheng Zhao, C. Fumeaux, C. Lim
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引用次数: 1

Abstract

This paper presents a novel Y-junction in folded substrate-integrated waveguide technology. The structure is analyzed with finite-element method using Ansys HFSS, and the simulation results show that the reflection coefficients of the 120° branch ports for the folded substrate-integrated waveguide Y-junction can satisfy the constraints for optimum performance of diplexers. In comparison with an unfolded substrate-integrated waveguide Y-junction, the characteristics of the presented structure can meet the constraints in a wider frequency band, which means that the flexibility for the selection of the up and down channel bands is increased.
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基板集成波导技术中的折叠y结
提出了一种新型的y结折叠基板集成波导技术。利用Ansys HFSS软件对该结构进行了有限元分析,仿真结果表明,折叠基板集成波导y结的120°分支端口的反射系数满足双工器的最佳性能约束。与未展开的基板集成波导y结相比,该结构的特性可以满足更宽频带的约束,这意味着增加了上行和下行信道频带选择的灵活性。
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