Cost and size reductions in implementing personal wireless communication transceivers through advances in CMOS RF integrated circuits

S. Allen, I. Bezzam, G. Richmond
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Abstract

This paper describes breakthroughs in RF integrated circuits that can drastically reduce the physical size of hand-held communication devices. Product developments in CMOS technology are emphasized so that the cost of the systems using these new ICs is also substantially improved. CMOS technology also offers a common platform to integrate most of the circuitry between the antenna and the audio interface (microphone/speaker). Specific examples are discussed for current and future standards such as GSM, PCS1900, DCS1800, DECT, DCT, and CTII.
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通过CMOS射频集成电路的进步,实现个人无线通信收发器的成本和尺寸降低
本文描述了射频集成电路的突破,可以大大减少手持通信设备的物理尺寸。强调CMOS技术的产品开发,因此使用这些新ic的系统成本也大大提高。CMOS技术还提供了一个通用平台来集成天线和音频接口(麦克风/扬声器)之间的大多数电路。具体的例子讨论了当前和未来的标准,如GSM、PCS1900、DCS1800、DECT、DCT和CTII。
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