{"title":"Comparative Survey of Techniques and Technologies Used in Transmit Path of Transmit Receive Module of AESA Radar","authors":"Muhammad Saqib, M. Arif, Rehan Akmal","doi":"10.1109/IBCAST.2019.8667234","DOIUrl":null,"url":null,"abstract":"Technologies and topologies used in the design and fabrication of high power amplifiers are considered deciding factor in the size, cost and performance of Transmit / Receive modules (TRMs) of modern Active Electronically Scanned Array (AESA) radar. In this paper, a survey of contemporary semiconductor technologies like Si, SiC, GaAs, GaN, SiGe and InP for the design and fabrication of transmit path of TRM has been presented. TRM architectures and packaging technologies are also reviewed in terms of ease of implementation with optimum outcome. GaN MMIC has been found as the latest trending technology for TRM transmit path due to higher power densities, reliability, lower cost per watt production, and higher efficiencies with ease of implementation. Multiple MMICs integrated in suitable packaging technology-based hybrid approach has been found as one of the cost-effective solutions with high end results in the design of TRM.","PeriodicalId":335329,"journal":{"name":"2019 16th International Bhurban Conference on Applied Sciences and Technology (IBCAST)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-03-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 16th International Bhurban Conference on Applied Sciences and Technology (IBCAST)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IBCAST.2019.8667234","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Technologies and topologies used in the design and fabrication of high power amplifiers are considered deciding factor in the size, cost and performance of Transmit / Receive modules (TRMs) of modern Active Electronically Scanned Array (AESA) radar. In this paper, a survey of contemporary semiconductor technologies like Si, SiC, GaAs, GaN, SiGe and InP for the design and fabrication of transmit path of TRM has been presented. TRM architectures and packaging technologies are also reviewed in terms of ease of implementation with optimum outcome. GaN MMIC has been found as the latest trending technology for TRM transmit path due to higher power densities, reliability, lower cost per watt production, and higher efficiencies with ease of implementation. Multiple MMICs integrated in suitable packaging technology-based hybrid approach has been found as one of the cost-effective solutions with high end results in the design of TRM.
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