M. Meinhardt, A. Alderman, J. Flannery, P. Cheasty, S. Eckert, C. Mathuna
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引用次数: 6
Abstract
The paper shows the motivation, methodology and early results of a review of the status of power electronic packaging (STATPEP) used in commercial DC/DCand AC/DC-switch mode power supplies. Based on the current status and the knowledge about the development of PEP over the last 5 to 10 years experience curves are developed which show the expected trends in PEP of power supplies for the future. The STATPEP project is being co-sponsored by the PSMA and participating companies.
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