E. Iwase, H. Onoe, A. Nakai, Kiyoshi Matsumoto, I. Shimoyama
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引用次数: 2
Abstract
We propose an integration method for arranging LED bare chips on a flexible substrate to fabricate a multi-color LED display. LED chips (240 ¿m × 240 ¿m × 75 ¿m) which were arrayed on an adhesive sheet were transferred to a flexible circuit substrate using our temparature-controlled transfer (TCT) and self-wiring (SW) method. Using these methods, we demonstrated a 5-by-5 LED flexible device and a two-color (blue and green) LED device, and observed light emission from the LED chips.
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