Millimeter Wave Wireless Link for On-board Chip to Chip Communication

T. Jang, Seongbae Jun, Seung Hun Kim, H. Son, D. Kang, Hyuncheol Park, C. Park
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Abstract

In this work, a 120 GHz wireless link for on-board chip-to-chip communication is presented for the case of a 20 mm transmission distance. A Y-shaped antenna is used for wideband, on-board connection, and a PA-antenna-LNA link is measured to evaluate the performance of the channel. The proposed link shows a 3.2 dB peak gain and a 14 GHz, 4 dB gain bandwidth. The 50 Gbps data transmission simulation in the 16-QAM modulation format is carried out. Although the nonideal characteristics of the wireless link cause interference among symbols, the interference can be suppressed by the use of a linear equalizer. Further work on the transmission between transmitter and receiver will be performed.
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毫米波无线链路板载芯片到芯片通信
在这项工作中,提出了一种用于板上芯片对芯片通信的120 GHz无线链路,用于20mm传输距离的情况。y形天线用于宽带板载连接,并测量pa -天线- lna链路以评估信道性能。所提出的链路具有3.2 dB的峰值增益和14ghz的4db增益带宽。对16-QAM调制格式下的50gbps数据传输进行了仿真。虽然无线链路的非理想特性会导致符号之间的干扰,但这种干扰可以通过使用线性均衡器来抑制。发射机和接收机之间的传输将进行进一步的工作。
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