Yutaka Hashimoto, Shunsuke Nakano, K. Takagi, Yuji Kawamata
{"title":"Soldering material for fine PoP (Package on Package)","authors":"Yutaka Hashimoto, Shunsuke Nakano, K. Takagi, Yuji Kawamata","doi":"10.1109/ICSJ.2014.7009613","DOIUrl":null,"url":null,"abstract":"The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.","PeriodicalId":362502,"journal":{"name":"IEEE CPMT Symposium Japan 2014","volume":"101 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"IEEE CPMT Symposium Japan 2014","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICSJ.2014.7009613","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The packages for PoP process will become finer as 0.3mm pitch and it is necessary for solder materials to choice finer powder as Type6 because of the better transfer capability and soldering capability.
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