A Study on the Influence of Thermal Interface Material in Passively Cooled Electrical Components with Attached Heatsink

Bulletin of the Polytechnic Institute of Iași. Machine constructions Section Pub Date : 2023-03-01 DOI:10.2478/bipcm-2023-0007

G. Chiriac, C. Dumitraș, Ionuţ Mertic

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Abstract

Abstract This paper studies the effect of the presence of a thermal interface material between a heat source and a heat sink. A heat sink is used as a passive cooling device for a thick film heating element used as a heat source. The heating element is fixed using 2 screws. The temperatures are measured in 2 scenarios: first, where the heating element is placed directly on the heat sink, and second, where a thermal pad is placed between the heat source and heat sink. Using a similar CAD model as the one tested and the same boundary conditions, finite element analysis were solved. The goal is to see if the finite element method delivers similar results as the measured ones and if the method is reliable in predicting the thermal behaviour of the electronic components. Temperature measurements show an improvement in heat source cooling when the thermal interface material is placed between the heat source and heating element. Also, the temperatures from the finite element analysis are similar to the measured ones, making the method reliable for similar applications.

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附带散热器的被动冷却电子元件中热界面材料的影响研究

摘要本文研究了热源与散热器之间存在热界面材料的影响。一种热沉用作作为热源的厚膜加热元件的被动冷却装置。加热元件用2颗螺钉固定。在两种情况下测量温度:第一种是将加热元件直接放在散热器上，第二种是在热源和散热器之间放置热垫。采用与试验模型相似的CAD模型，在相同的边界条件下进行有限元分析。目的是看看有限元方法是否提供与测量结果相似的结果，以及该方法在预测电子元件的热行为方面是否可靠。温度测量表明，当热界面材料被放置在热源和加热元件之间时，热源冷却得到了改善。此外，有限元分析得到的温度与实测温度相似，使得该方法在类似应用中是可靠的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Bulletin of the Polytechnic Institute of Iași. Machine constructions Section

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