Analysis of the different impact of the external Gate Resistance in 3-lead and 4-lead SuperJunction MOSFETs

M. Cacciato, F. Giorgio, Domenico Nardo, S. Rizzo, N. Salerno, G. Scarcella, Alfio Scuto, G. Sorrentino, Giovanni Vinci
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引用次数: 1

Abstract

In this paper, a comparison between two SuperJunction MOSFET technologies that only differ in the package solution (3-lead vs 4-lead) has been performed. A PFC boost converter test vehicle has been adopted to compare them at different gate resistance and load current to analyze their mutual effect on the performance of the device. The results highlighted that the switching energy reduction in 4-lead MOSFETs increases as the load increases. This advantage also intensifies as the gate resistance increases. Another interesting aspect that arose from the analyses is that the two packaging solutions present the same damping of the oscillation although the higher switching speed of the 4-lead solution involves greater current derivative, overcurrent and oscillations amplitude which could cause more EMI issues.
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分析三引线和四引线超结mosfet中外部栅极电阻的不同影响
在本文中,对两种SuperJunction MOSFET技术进行了比较,这两种技术仅在封装解决方案(3引脚vs 4引脚)上有所不同。采用PFC升压变换器试验车,在不同栅极电阻和负载电流下对其进行比较,分析其相互作用对器件性能的影响。结果表明,随着负载的增加,4导联mosfet的开关能量减小量也在增加。这种优势也随着栅极电阻的增加而增强。从分析中产生的另一个有趣的方面是,两种封装解决方案呈现出相同的振荡阻尼,尽管4引脚解决方案的更高开关速度涉及更大的电流导数,过电流和振荡幅度,这可能导致更多的EMI问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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