On the High-Temperature Relaxation Peak in F.C.C. Metals

J. T. Roberts, P. Barrand
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引用次数: 5

Abstract

AbstractA high-temperature relaxation peak (H.T.P.) has been observed at T(°K) ≥ 0·5 Tm in the damping spectra of pure silver and pure copper, in large-grained wire specimens. The relaxation strength of the peak in copper was ∼ 8 times larger than that for silver, though the incidence of “bamboo” grain boundaries was comparable. The occurrence of the peak was associated with the development of a “bamboo” grain structure and was attributed to the reversible shear or glide of boundaries at high temperatures, coupled with the movement of boundary jogs. Trace impurities rapidly suppressed the peak, this phenomenon being explained in terms of the impurity atoms poisoning the jogs and inhibiting their movement.
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氟化金属的高温弛豫峰
在大晶粒金属丝试样中,在T(°K)≥0.5 Tm处,纯银和纯铜的阻尼谱中存在高温弛豫峰(H.T.P.)。铜中峰的弛豫强度是银的约8倍,尽管“竹”晶界的发生率是相当的。峰的出现与“竹”状颗粒结构的发展有关,并归因于高温下边界的可逆剪切或滑动,加上边界慢跑的运动。微量杂质迅速抑制了峰值,这种现象被解释为杂质原子毒害了慢跑并抑制了它们的运动。
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