{"title":"Surface activated wafer bonding of LiNbO3 and SiO2/Si for LNOI on Si","authors":"R. Takigawa, E. Higurashi, T. Asano","doi":"10.23919/LTB-3D.2017.7947443","DOIUrl":null,"url":null,"abstract":"Wafer-level bonding of LiNbO<inf>3</inf> (LN) and Si with thermally grown SiO<inf>2</inf> layer is demonstrated using surface-activated bonding method for the realization of LiNbO<inf>3</inf>-on-Insulator (LNOI) on Si.","PeriodicalId":183993,"journal":{"name":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","volume":"2 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2017-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/LTB-3D.2017.7947443","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Wafer-level bonding of LiNbO3 (LN) and Si with thermally grown SiO2 layer is demonstrated using surface-activated bonding method for the realization of LiNbO3-on-Insulator (LNOI) on Si.
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