A Broadband Model Over 1–325 GHz for GSG Pad Structure in InP HBT Technology

Zhongchao Xu, Jun Liu, Haiyan Lu, Wei Cheng, Feng Qian, H. Tao
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Abstract

A broadband model for Ground-Signal-Ground (GSG) pad in InP HBT technology is presented. The inductive parasitics of the structure is considered. A method to analytically extract the model parameters is proposed. For model extraction convenience, the pad is designed as structure of one-side. The model renders excellent agreement with the measured and simulated data over 1 to 325 GHz, for a pad structure manufactured in 0.5um InP HBT technology.
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InP HBT技术中GSG Pad结构1-325 GHz以上宽带模型
提出了一种基于InP HBT技术的地-信-地(GSG)发射台宽带模型。考虑了结构的感应寄生。提出了一种解析提取模型参数的方法。为了便于模型提取,垫块设计为单面结构。对于采用0.5um InP HBT技术制造的衬垫结构,该模型与1至325 GHz范围内的测量和模拟数据非常吻合。
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