Analysis of noise isolation methods on split power/ground plane of multi-layered package and PCB for low jitter mixed mode system

Y. Jeong, Hyungsoo Kim, Jingook Kim, Jongbae Park, Joungho Kim
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引用次数: 5

Abstract

Various noise isolation methods for low jitter on the power/ground plane are thoroughly analyzed and a new method is proposed. We analyzed using both frequency and time domain measurement methods and the results were verified by jitter measurements.
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低抖动混合模式系统多层封装和PCB分电源/地平面的隔声方法分析
深入分析了功率/地平面低抖动的各种噪声隔离方法,提出了一种新的隔离方法。我们使用频域和时域测量方法进行分析,并通过抖动测量验证了结果。
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