Numerical simulation of an electromagnetic aggression on a FACT component and investigation on package effect

G. Akoun, O. Coumar, C. Tavernier
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Abstract

This paper presents different approaches made by numerical simulation to study the behavior of electronic components and the effect of their package, when submitted to an ElectroMagnetic (EM) aggression. The simulations are performed using several codes: DESSIS-ISE, SPICE, ELF3D and ELFI3S. The EM susceptibility of an input buffer (FACT technology) is investigated. Continuous Wave (CW) type aggressions with different frequencies and amplitudes are simulated. The results emphasize differences between component simulation tools. However, the most significant differences are observed between EM interactions at the component levels and at the package level. In particular, a noise filtering process due to the package appears at sufficiently high frequencies.
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FACT组件电磁攻击的数值模拟及封装效应研究
本文介绍了不同的数值模拟方法来研究电子元件在受到电磁攻击时的行为及其封装的影响。使用DESSIS-ISE、SPICE、ELF3D和ELFI3S等代码进行了仿真。研究了输入缓冲器(FACT技术)的电磁磁化率。模拟了不同频率和幅值的连续波(CW)型侵袭。结果强调了组件仿真工具之间的差异。然而,在组件级别和包级别的EM交互之间观察到最显著的差异。特别是,由于封装的噪声滤波过程出现在足够高的频率。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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