A New Semi-Supervised Deep Learning Approach for Intelligent Defects Recognition

Yiping Gao, Liang Gao, Xinyu Li
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Abstract

Intelligent defect recognition (IDR) is one of the important technologies in production. Deep learning (DL) has drawn more and more attentions in IDR. Whereas, DL methods usually need large labelled training datasets, while the unlabeled is idle and not considered yet. In some cases, the requirement is difficult to satisfy. This is because labelling large datasets are costly, and the defect recognition might be delayed until getting enough labelled samples. To overcome this limitation, a semi-supervised DL approach for defect recognition, which uses the unlabeled samples to improve the accuracy, is introduced in this paper. This method uses a convolutional autoencoder to extract the common feature from both labelled and unlabeled samples, and only a few samples are required to finetune the network. The experimental results suggest that the proposed method achieves competitive results under limited labelled samples, and the accuracy outperforms the other approachs. Furthermore, the noise analysis also suggest this method performs robust for noisey samples.
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一种新的半监督深度学习智能缺陷识别方法
智能缺陷识别(IDR)是生产中的重要技术之一。深度学习在IDR领域受到越来越多的关注。然而,深度学习方法通常需要大量标记的训练数据集,而未标记的训练数据集则是闲置的,尚未被考虑。在某些情况下,需求很难满足。这是因为标记大型数据集是昂贵的,并且缺陷识别可能会延迟,直到获得足够的标记样本。为了克服这一限制,本文引入了一种半监督深度学习缺陷识别方法,该方法利用未标记的样本来提高缺陷识别的准确性。该方法使用卷积自编码器从标记和未标记的样本中提取共同特征,并且只需要少量样本来微调网络。实验结果表明,该方法在有限的标记样本下取得了较好的结果,且准确率优于其他方法。此外,噪声分析也表明该方法对噪声样本具有较强的鲁棒性。
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