A 64-channel wireless neural sensing microsystem with TSV-embedded micro-probe array for neural signal acquisition

2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS) Pub Date : 2017-06-18 DOI:10.1109/TRANSDUCERS.2017.7993979

Yu-Chieh Huang, Po-Tsang Huang, Yu-Chen Hu, Shang-Lin Wu, Y. You, Yung-Kuei Wang, J. Duann, Tzai-Wen Chiu, W. Hwang, Kuan-Neng Chen, C. Chuang, J. Chiou

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Abstract

To enhance the signal integrity of high-density neural-sensing signals, this work presents an implantable high spatial resolution μ-probe array with through-silicon via (TSV) 2.5D integration technology that realizes a miniaturized implantable device on flexible printed circuit (FPC) interposer. The proposed microsystem was composed of two 32-channel neural sensing chips and one radio frequency chip for neural signal processing. The μ-probe array can achieve better signal-to-noise ratio with neural-signal acquisition and processing circuit composed of a pseudo-resistor-based analog front-end amplifier. Moreover, a receiving antenna is also implemented on the backside of FPC for wireless data and power transmission. The feasibility of the proposed μ-probe array, Tx and Rx antenna, 32-channel neural sensing circuits in the 64-channel wireless microsystem have been successfully demonstrated for future integration and animal experiments.

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基于tsv嵌入式微探针阵列的64通道无线神经传感微系统

为了提高高密度神经传感信号的信号完整性，本文提出了一种可植入的高空间分辨率μ探针阵列，采用透硅孔(TSV) 2.5D集成技术，实现了可植入器件在柔性印刷电路(FPC)介面上的小型化。该微系统由2个32通道神经传感芯片和1个用于神经信号处理的射频芯片组成。μ探针阵列采用基于伪电阻的模拟前端放大器构成的神经信号采集与处理电路，可以获得较好的信噪比。此外，在FPC的背面还实现了接收天线，用于无线数据和电力传输。所提出的μ探针阵列、Tx和Rx天线、32通道神经传感电路在64通道无线微系统中的可行性已经成功地证明了未来集成和动物实验的可行性。

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2017 19th International Conference on Solid-State Sensors, Actuators and Microsystems (TRANSDUCERS)

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