The challenge of GaAs IC manufacturing in Taiwan for Asian Pacific wireless market

L.W. Yang, P. Chao, L. Wu
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引用次数: 1

Abstract

The authors consider the market perspectives of the Asia Pacific area, describe a business model based on the track records of silicon IC manufacturing, and highlight technology challenges.
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台湾GaAs集成电路制造对亚太无线市场的挑战
作者考虑了亚太地区的市场前景,描述了基于硅集成电路制造记录的商业模式,并强调了技术挑战。
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60GHz-band high-gain MMIC cascode HBT amplifier An 850 nm wavelength monolithic integrated photoreceiver with a single-power-supplied transimpedance amplifier based on GaAs PHEMT technology A monolithic X-band class-E power amplifier Extremely high P1dB MMIC amplifiers for Ka-band applications Ultra low noise 2.5 Gbit/s 3.3V transimpedance amplifier with automatic gain control
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