What's next in robots? ∼Sensing, processing, networking toward human brain and body

K. Arimoto, Sam Kavusi, J. Salisbury
{"title":"What's next in robots? ∼Sensing, processing, networking toward human brain and body","authors":"K. Arimoto, Sam Kavusi, J. Salisbury","doi":"10.1109/ISSCC.2012.6177109","DOIUrl":null,"url":null,"abstract":"Most of us dreamt about robots in our childhood interacting and assisting us in our daily life. They are way beyond fiction and have emerged to become unavoidable in minimally-invasive surgery and industrial automation. There is also an explosion in research areas around autonomous cars, humanoid/android, medical, mobile remote manipulation and personal assistance robots. Such advances largely benefit from to the advances in sensing, signal processing, analog/digital circuits, and devices in semiconductor technologies that are driven by consumer and automotive electronics. Increasingly robotic platforms are also benefiting from the wirelessly connected infrastructure and the cloud computing. Expansion of such applications is going to require more human-friendly and humanlike interactive systems. Improvements in energy efficiency, dependability, security, intelligent sensor networks are among technologies, which are expected from the next generation silicon system, that provide the means to the development of the next generation interactive robots. However, more closed collaboration of the hardware/software design, integration, and data fusion are also must. Robot developers' wish list for the semiconductor industry is endless and their creativ ity is admirable.","PeriodicalId":255282,"journal":{"name":"2012 IEEE International Solid-State Circuits Conference","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2012-04-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 IEEE International Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.2012.6177109","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

Most of us dreamt about robots in our childhood interacting and assisting us in our daily life. They are way beyond fiction and have emerged to become unavoidable in minimally-invasive surgery and industrial automation. There is also an explosion in research areas around autonomous cars, humanoid/android, medical, mobile remote manipulation and personal assistance robots. Such advances largely benefit from to the advances in sensing, signal processing, analog/digital circuits, and devices in semiconductor technologies that are driven by consumer and automotive electronics. Increasingly robotic platforms are also benefiting from the wirelessly connected infrastructure and the cloud computing. Expansion of such applications is going to require more human-friendly and humanlike interactive systems. Improvements in energy efficiency, dependability, security, intelligent sensor networks are among technologies, which are expected from the next generation silicon system, that provide the means to the development of the next generation interactive robots. However, more closed collaboration of the hardware/software design, integration, and data fusion are also must. Robot developers' wish list for the semiconductor industry is endless and their creativ ity is admirable.
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机器人的下一个发展方向是什么?对人脑和人体的传感、处理、联网
我们大多数人在童年时都梦想着机器人在日常生活中与我们互动和帮助我们。它们远远超出了虚构的范畴,在微创手术和工业自动化中已经成为不可避免的存在。在自动驾驶汽车、类人机器人、医疗、移动远程操作和个人辅助机器人等研究领域也出现了爆炸式增长。这些进步很大程度上得益于由消费电子和汽车电子驱动的传感、信号处理、模拟/数字电路和半导体技术器件的进步。越来越多的机器人平台也受益于无线连接的基础设施和云计算。这些应用程序的扩展将需要更加人性化和人性化的交互系统。能源效率、可靠性、安全性、智能传感器网络等方面的改进是下一代硅系统所期望的技术,为下一代交互式机器人的发展提供了手段。然而,硬件/软件的设计、集成和数据融合也必须更加紧密地协作。机器人开发人员对半导体行业的愿望清单是无穷无尽的,他们的创造力令人钦佩。
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