Concurrent placement algorithm and floorplanning based on Occam and the transputer technology

Abstract

In VLSI (very large scale integration), placement is the process of physically placing all electronic functions on a piece of silicon such that minimum wiring and minimum area occupied on silicon are achieved. The paper discusses the feasibility of employing the concurrency and parallel techniques in the placement and floorplanning problem. The hierarchical technique described in the previous work (A. Al Mohanadi, 1989) is carried out sequentially on one processing machine. The placement problem is dealt with sequentially for each level of hierarchy. This technique requires significant CPU time to complete but several placement problems would be solved simultaneously through the use of the parallel processing approach.<>