Characterization of a new designed octahedron slotted metal track by simulations

J. Kludt, K. Weide-Zaage, M. Ackermann, V. Hein
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引用次数: 4

Abstract

Highly robust metallizations in ICs for high temperature and high current applications are needed. Special thick metal layers often known as “power metals” are added to achieve a higher current capability. But these metallizations suffer from reliability limitations as well. Therefore a new design for “power metals” was created for a 0.35μm aluminium CMOS process. The reliability of a new power metal structure is investigated in this article. A determination of the thermal-electrical and thermo-mechanical behaviour is carried out by simulations.
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新型八面体开槽金属轨道的仿真表征
在高温和高电流应用的集成电路中需要高度坚固的金属化。通常被称为“动力金属”的特殊厚金属层被添加以实现更高的电流能力。但是这些金属化也受到可靠性的限制。因此,为0.35μm铝CMOS工艺创建了一种新的“动力金属”设计。本文研究了一种新型电力金属结构的可靠性问题。通过模拟确定了热电和热机械行为。
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