S. Anger, Felix Klingert, V. Häublein, M. Pfeffer, M. Schellenberger
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引用次数: 0
Abstract
Fraunhofer IISB offers prototyping services for electron devices. To meet economic requirements despite a unique flexibility in regard to wafer size, semiconductor material, and processes in manufacturing, a smart platform for rapid prototyping is under development. This paper reports on three embedding solution approaches: The implementation of stable baseline modules, smart experiments including data analytics, and smart logistics with a flexible MES. All were developed and partially implemented within the iDev40 project. The interaction of the solution approaches has the overall goal of reducing the integration time of novel processes into the manufacturing line by about 20%.