Ferrule endface dimension optimization for standard outer diameter 4-core fiber connector

IF 0.6 4区 工程技术 Q4 ENGINEERING, ELECTRICAL & ELECTRONIC IEICE Transactions on Electronics Pub Date : 2023-01-01 DOI:10.1587/transele.2023emp0001
Kiyoshi KAMIMURA, Yuki FUJIMAKI, Kentaro MATSUDA, Ryo NAGASE
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引用次数: 1

Abstract

Physical contact (PC) optical connectors realize long-term stability by maintaining contact with the optical fiber even during temperature fluctuations caused by the microscopic displacement of the ferrule endface. With multicore fiber (MCF) connectors, stable PC connection conditions need to be newly investigated because MCFs have cores other than at the center. In this work, we investigated the microscopic displacement of connected ferrule endfaces using the finite element method (FEM). As a result, by using MCF connectors with an apex offset, we found that the allowable fiber undercut where all the cores make contact is slightly smaller than that of single-mode fiber (SMF) connectors. Therefore, we propose a new equation for determining the allowable fiber undercut of MCF connectors. We also fabricated MCF connectors with an allowable fiber undercut and confirmed their reliability using the composite temperature/humidity cyclic test.
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标准外径4芯光纤连接器护套端面尺寸优化
物理接触型(PC)光连接器通过保持与光纤的接触,实现了长期的稳定性,即使在温度波动引起的微观位移的插针端面。对于多芯光纤(MCF)连接器,由于MCF的核心不在中心,因此需要对稳定的PC连接条件进行新的研究。在这项工作中,我们研究了用有限元法(FEM)连接卡箍端面的微观位移。因此,通过使用具有顶点偏移的MCF连接器,我们发现所有芯接触处的允许光纤侧切略小于单模光纤(SMF)连接器。因此,我们提出了一种新的确定MCF连接器允许光纤侧切的公式。我们还制作了允许光纤下切的MCF连接器,并通过复合材料温度/湿度循环测试验证了其可靠性。
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来源期刊
IEICE Transactions on Electronics
IEICE Transactions on Electronics 工程技术-工程:电子与电气
CiteScore
1.00
自引率
20.00%
发文量
79
审稿时长
3-6 weeks
期刊介绍: Currently, the IEICE has ten sections nationwide. Each section operates under the leadership of a section chief, four section secretaries and about 20 section councilors. Sections host lecture meetings, seminars and industrial tours, and carry out other activities. Topics: Integrated Circuits, Semiconductor Materials and Devices, Quantum Electronics, Opto-Electronics, Superconductive Electronics, Electronic Displays, Microwave and Millimeter Wave Technologies, Vacuum and Beam Technologies, Recording and Memory Technologies, Electromagnetic Theory.
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