The Effect of Thermal Cycle on Hot Cracking Evolution and Formation Mechanism in Thin Wall, Single Layer, and Cubic Samples of High-Strength Al-Cu-Mg-Mn Alloys Fabricated by Laser Powder Bed Fusion
Xiaojia Nie, Fei Peng, Zhiheng Hu, Yang Qi, Haihong Zhu, Hu Zhang
{"title":"The Effect of Thermal Cycle on Hot Cracking Evolution and Formation Mechanism in Thin Wall, Single Layer, and Cubic Samples of High-Strength Al-Cu-Mg-Mn Alloys Fabricated by Laser Powder Bed Fusion","authors":"Xiaojia Nie, Fei Peng, Zhiheng Hu, Yang Qi, Haihong Zhu, Hu Zhang","doi":"10.1089/3dp.2023.0167","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":54341,"journal":{"name":"3D Printing and Additive Manufacturing","volume":null,"pages":null},"PeriodicalIF":2.3000,"publicationDate":"2023-12-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"3D Printing and Additive Manufacturing","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.1089/3dp.2023.0167","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, MANUFACTURING","Score":null,"Total":0}
期刊介绍：
3D Printing and Additive Manufacturing is a peer-reviewed journal that provides a forum for world-class research in additive manufacturing and related technologies. The Journal explores emerging challenges and opportunities ranging from new developments of processes and materials, to new simulation and design tools, and informative applications and case studies. Novel applications in new areas, such as medicine, education, bio-printing, food printing, art and architecture, are also encouraged.
The Journal addresses the important questions surrounding this powerful and growing field, including issues in policy and law, intellectual property, data standards, safety and liability, environmental impact, social, economic, and humanitarian implications, and emerging business models at the industrial and consumer scales.
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