Enhancing the Mechanical Properties of Transient-Liquid-Phase Bonded Inconel 617 to Stainless Steel 310 through Altering Process Parameters and Homogenisation

IF 4.7 3区材料科学 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC ACS Applied Electronic Materials Pub Date : 2024-07-04 DOI:10.3390/jmmp8040143

Arash Dehghan, R. Emadi, Yunes Asghari, Hosein Emadi, S. Lotfian

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Abstract

This study investigated the impact of temperature, time, and homogenisation on the transient liquid phase bonding of Inconel 617 to stainless steel 310, employing AWS BNI2 foil as an interlayer. Nine test series were conducted at temperatures of 1050 °C and 1100 °C, with bonding durations ranging from 10 to 60 min. The homogenisation process was carried out on specimens that underwent full isothermal solidification at a temperature of 1170 °C for 180 min. The microscopic analysis indicated that extending the time and raising the bonding temperature resulted in the extension of the isothermal solidified zone, accompanied by a reduction in the quantity of eutectic phases. Complete isothermal solidification was seen exclusively in samples bonded at temperatures of 1050 °C for 60 min and 1100 °C for a duration of 50 min. The size of the diffusion-affected zone expanded as the bonding temperature and duration rose, but the presence of brittle intermetallic phases diminished. The microstructure of the homogenised sample indicated that the diffusion-affected zone had been almost completely eliminated. Hardness variations indicated heightened hardness in the diffusion-affected zone (DAZ) and athermal solidified zone (ASZ). Shear strength is maximised in homogenised specimens with minimised ASZ.

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通过改变工艺参数和均质化提高瞬态液相结合铬镍铁合金 617 与不锈钢 310 的机械性能

本研究采用 AWS BNI2 箔作为中间层，调查了温度、时间和均质化对 Inconel 617 与不锈钢 310 的瞬态液相粘合的影响。在 1050 ℃ 和 1100 ℃ 的温度下进行了九个系列的测试，粘合持续时间从 10 分钟到 60 分钟不等。均质过程是在试样上进行的，试样在 1170 °C 的温度下完全等温凝固了 180 分钟。显微分析表明，延长时间和提高粘合温度导致等温凝固区扩大，同时共晶相的数量减少。完全等温凝固只出现在温度为 1050 ℃、持续 60 分钟和温度为 1100 ℃、持续 50 分钟的粘合样品中。扩散影响区的面积随着粘结温度和持续时间的增加而扩大，但脆性金属间相的存在却减少了。均质样品的微观结构表明，扩散影响区几乎完全消失。硬度变化表明，扩散影响区（DAZ）和热凝固区（ASZ）的硬度有所提高。均质试样的剪切强度最大，ASZ 最小。

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来源期刊

ACS Applied Electronic Materials Multiple-

CiteScore

7.20

自引率

4.30%

发文量

567

期刊介绍： ACS Applied Electronic Materials is an interdisciplinary journal publishing original research covering all aspects of electronic materials. The journal is devoted to reports of new and original experimental and theoretical research of an applied nature that integrate knowledge in the areas of materials science, engineering, optics, physics, and chemistry into important applications of electronic materials. Sample research topics that span the journal's scope are inorganic, organic, ionic and polymeric materials with properties that include conducting, semiconducting, superconducting, insulating, dielectric, magnetic, optoelectronic, piezoelectric, ferroelectric and thermoelectric. Indexed/Abstracted： Web of Science SCIE Scopus CAS INSPEC Portico

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