{"title":"Effect of individual and synergistic alloying of In and Ni on microstructure, phase stability and thermal properties of lead-free Sn-0.7Cu solder","authors":"Ayushi Thakur, Jayant Jain, Sangeeta Santra","doi":"10.1080/14786435.2024.2383771","DOIUrl":null,"url":null,"abstract":"The study explores the individual and synergistic effect of alloying indium (In) and nickel (Ni) with Sn-0.7 wt.% Cu solder on microstructure and thermal properties. Solders consist of β-Sn phase m...","PeriodicalId":19856,"journal":{"name":"Philosophical Magazine","volume":"38 1","pages":""},"PeriodicalIF":1.5000,"publicationDate":"2024-07-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Philosophical Magazine","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1080/14786435.2024.2383771","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q4","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
The study explores the individual and synergistic effect of alloying indium (In) and nickel (Ni) with Sn-0.7 wt.% Cu solder on microstructure and thermal properties. Solders consist of β-Sn phase m...
期刊介绍：
The Editors of Philosophical Magazine consider for publication contributions describing original experimental and theoretical results, computational simulations and concepts relating to the structure and properties of condensed matter. The submission of papers on novel measurements, phases, phenomena, and new types of material is encouraged.
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