Zinc Orthophosphate Can Reduce Nitrate-Induced Corrosion of Lead Solder

Abstract

Nitrate-induced spallation of lead-bearing solder particles into drinking water is not sufficiently controlled by phosphate-based inhibitors, although adding zinc can improve their performance. Studies using copper coupons coated with new lead–tin solder in water with up to 12 mg/L nitrate demonstrated that zinc orthophosphate reduced lead release by more than 90% and outperformed orthophosphate alone. Lead release and spallation from harvested pipes with decades-old lead–tin solder in a high nitrate water were improved but not eliminated with zinc orthophosphate over a period of months. When applied at a water utility with high source water nitrate, monthly in-home field sampling showed that 90th percentile lead levels dropped below the action level after dosing zinc orthophosphate at full scale for 6 months. Scanning electron microscopy (SEM) analysis of pipe scales revealed that zinc and orthophosphate codeposit at the copper–solder interface and may act as a mixed inhibitor, with zinc inhibiting the cathodic reaction on the copper pipe, phosphate limiting the anodic reaction, and an added benefit of zinc orthophosphate preferentially precipitating at the galvanic interface between the anode and the cathode. Updates to corrosion control guidance for waters with higher nitrate due to seasonal runoff or source water changes are needed.

Zinc orthophosphate reduced nitrate-induced solder corrosion in laboratory studies and at a water utility. It was found to reduce anodic and cathodic corrosion while preferentially precipitating at the copper–solder interface.