{"title":"Enhanced thermal performance and stability of non-gallium liquid metal composites","authors":"Wenkui Xing , Jie Liu , Yuda Su , Chengyi Song","doi":"10.1016/j.matlet.2024.137614","DOIUrl":null,"url":null,"abstract":"<div><div>This paper presents a study on the thermal performance and stability of non-gallium liquid metal (BiPbInSnCd alloy with melting point 47 °C) composite. It has been found that incorporating copper particles and copper foam into the non-gallium liquid metal can help to enhance the overall thermal conductivity, and achieved longer lifetime than gallium-based liquid metal composite. We have demonstrated that the average thermal conductivity of non-gallium liquid metal composite with filler weight ratio of 44.4 % can reach as high as 28.9 W·m<sup>−1</sup>·K<sup>−1</sup>. The improvement mechanism and the impact of preparation methods on the thermal performance have been also investigated.</div></div>","PeriodicalId":384,"journal":{"name":"Materials Letters","volume":"378 ","pages":"Article 137614"},"PeriodicalIF":2.7000,"publicationDate":"2024-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Letters","FirstCategoryId":"88","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S0167577X24017543","RegionNum":4,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"MATERIALS SCIENCE, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0
Abstract
This paper presents a study on the thermal performance and stability of non-gallium liquid metal (BiPbInSnCd alloy with melting point 47 °C) composite. It has been found that incorporating copper particles and copper foam into the non-gallium liquid metal can help to enhance the overall thermal conductivity, and achieved longer lifetime than gallium-based liquid metal composite. We have demonstrated that the average thermal conductivity of non-gallium liquid metal composite with filler weight ratio of 44.4 % can reach as high as 28.9 W·m−1·K−1. The improvement mechanism and the impact of preparation methods on the thermal performance have been also investigated.
期刊介绍：
Materials Letters has an open access mirror journal Materials Letters: X, sharing the same aims and scope, editorial team, submission system and rigorous peer review.
Materials Letters is dedicated to publishing novel, cutting edge reports of broad interest to the materials community. The journal provides a forum for materials scientists and engineers, physicists, and chemists to rapidly communicate on the most important topics in the field of materials.
Contributions include, but are not limited to, a variety of topics such as:
• Materials - Metals and alloys, amorphous solids, ceramics, composites, polymers, semiconductors
• Applications - Structural, opto-electronic, magnetic, medical, MEMS, sensors, smart
• Characterization - Analytical, microscopy, scanning probes, nanoscopic, optical, electrical, magnetic, acoustic, spectroscopic, diffraction
• Novel Materials - Micro and nanostructures (nanowires, nanotubes, nanoparticles), nanocomposites, thin films, superlattices, quantum dots.
• Processing - Crystal growth, thin film processing, sol-gel processing, mechanical processing, assembly, nanocrystalline processing.
• Properties - Mechanical, magnetic, optical, electrical, ferroelectric, thermal, interfacial, transport, thermodynamic
• Synthesis - Quenching, solid state, solidification, solution synthesis, vapor deposition, high pressure, explosive
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