Mengyu Liang, Xing Liu, Di Liu, Xiaopeng Li, Xianjin Hu, Chenyang Feng, Ting-Ting Li, Jia-Horng Lin, Boyan Chang, Jie Chen
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引用次数: 0
Abstract
The curing rate of epoxy resins is a critical parameter that significantly influences the curing properties of polymer matrix composites (PMCs). It plays a vital role in meeting high-performance requirements, particularly in achieving rapid development of high modulus. The paper reviews the current state of research on the curing of epoxy resins in PMCs, including theoretical studies on the curing kinetics of the curing rate. The effects of curing methods, curing agents, accelerators, functional fillers and composite curing processes on the curing rate and mechanical properties are also reviewed. In addition, the relationship between curing rate and mechanical properties of epoxy composites under different influencing factors is reviewed. The review aims to provide research ideas for obtaining advanced structural composites with fast curing and excellent mechanical properties.
期刊介绍：
Journal of Polymer Research provides a forum for the prompt publication of articles concerning the fundamental and applied research of polymers. Its great feature lies in the diversity of content which it encompasses, drawing together results from all aspects of polymer science and technology.
As polymer research is rapidly growing around the globe, the aim of this journal is to establish itself as a significant information tool not only for the international polymer researchers in academia but also for those working in industry. The scope of the journal covers a wide range of the highly interdisciplinary field of polymer science and technology, including:
polymer synthesis;
polymer reactions;
polymerization kinetics;
polymer physics;
morphology;
structure-property relationships;
polymer analysis and characterization;
physical and mechanical properties;
electrical and optical properties;
polymer processing and rheology;
application of polymers;
supramolecular science of polymers;
polymer composites.
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