Foam-Structured Strain Sensor-Based Elastic Wearable System for Pulse Wave Detection

IF 4.1 2区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC IEEE Electron Device Letters Pub Date : 2024-11-13 DOI:10.1109/LED.2024.3496859
Shuxiang Lin;Siyu Tong;Jiaqi Niu;Runze Li;Qunfeng Niu;Peng Li;Li Wang;Shujing Lin
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Abstract

Timely detection of abnormal pulse wave conditions can provide early warnings for cardiovascular emergencies. Strain sensors can detect subtle pulse wave changes, however, they often face a trade-off between flexibility and accuracy. Herein, we present a cost-effective, high-sensitivity elastic strain sensor based on foam-structured silicone rubber@nanocarbon black (SR@CB). The sensor exhibits excellent linearity within a strain range of 0-60%, with a detection sensitivity of 0.1% and a gauge factor of up to 32. Thus, it can detect not only subtle pulse wave signals, but also be used for motion monitoring. Moreover, we have developed an elastic circuit detection system prototype, significantly enhancing wearer comfort while achieving a fully elastic detection system. We foresee this fully elastic detection system holds promise for health monitoring and motion detection applications.
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基于泡沫结构应变传感器的脉冲波检测弹性可穿戴系统
及时发现脉搏波异常情况,可为心血管突发事件提供早期预警。应变传感器可以检测细微的脉冲波变化,然而,它们经常面临灵活性和准确性之间的权衡。在此,我们提出了一种基于泡沫结构硅胶rubber@nanocarbon黑色(SR@CB)的高性价比,高灵敏度弹性应变传感器。该传感器在0-60%的应变范围内具有良好的线性,检测灵敏度为0.1%,测量系数高达32。因此,它不仅可以检测细微的脉冲波信号,还可以用于运动监测。此外,我们还开发了一种弹性电路检测系统原型,在实现全弹性检测系统的同时显着提高了佩戴者的舒适度。我们预见到这种完全弹性的检测系统有望用于健康监测和运动检测应用。
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来源期刊
IEEE Electron Device Letters
IEEE Electron Device Letters 工程技术-工程:电子与电气
CiteScore
8.20
自引率
10.20%
发文量
551
审稿时长
1.4 months
期刊介绍: IEEE Electron Device Letters publishes original and significant contributions relating to the theory, modeling, design, performance and reliability of electron and ion integrated circuit devices and interconnects, involving insulators, metals, organic materials, micro-plasmas, semiconductors, quantum-effect structures, vacuum devices, and emerging materials with applications in bioelectronics, biomedical electronics, computation, communications, displays, microelectromechanics, imaging, micro-actuators, nanoelectronics, optoelectronics, photovoltaics, power ICs and micro-sensors.
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