Obtaining ultrafine-grained structure in copper/steel/copper multi-laminated composite by different accumulative roll bonding methods

IF 3.9 2区 材料科学 Q2 MATERIALS SCIENCE, MULTIDISCIPLINARY Vacuum Pub Date : 2025-06-01 Epub Date: 2025-02-22 DOI:10.1016/j.vacuum.2025.114155
Ailing Ran , Ali Afshar , Shirin Mehmet , Yusuf Kemal
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Abstract

The relative rollers rotation during roll-bonding affects the effective strain applied to composite layers. In this paper, the differential speed accumulative roll bonding (DSARB) and conventional accumulative roll bonding (CARB) methods were incorporated to fabricate Cu/St/Cu multi-laminated composites. Based on the observation of microstructures, the evolution of microstructure of composites contained necking and rupturing of St layers. In the composite fabricated by DSARB, the St layers showed more irregularities and better distribution in Cu matrix compared to CARB. Based on the observation of grain structures, both methods resulted in ultra-fine-grained structure in layers. However, the DSARB method led to a more pronounced decrement in grain size. The lowest grain size of St and Cu were 2.9 μm and 1.4 μm, respectively, in the DSARB method. Similarly, this method could result in a higher hardness of 401 HV for St and 232 HV for Cu. Also, compared to composite processed by CARB, higher yield and ultimate strength values of 488 MPa and 798 MPa were seen in composite fabricated by DSARB, after seven passes. Furthermore, the fracture surface showed shallower and more sheared dimples in the composite fabricated by DSARB.
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通过不同的累积轧制结合方法获得铜/钢/铜多层复合材料的超细晶组织
滚接过程中辊的相对旋转影响复合材料层的有效应变。将差速累积辊焊(DSARB)和常规累积辊焊(CARB)相结合,制备了Cu/St/Cu多层复合材料。通过显微组织观察发现,复合材料的显微组织演变过程包含了St层的颈缩和断裂。在DSARB制备的复合材料中,与CARB相比,St层在Cu基体中表现出更多的不规则性和更好的分布。通过对晶粒结构的观察,两种方法均可获得超细晶粒结构。然而,DSARB方法导致晶粒尺寸更明显的减少。在DSARB法中,St和Cu的最小晶粒尺寸分别为2.9 μm和1.4 μm。同样,这种方法可以使St的硬度达到401 HV, Cu的硬度达到232 HV。经过7道次后,DSARB复合材料的屈服强度和极限强度分别为488 MPa和798 MPa,高于CARB复合材料。此外,DSARB制备的复合材料断口呈现出更浅、更多的剪切韧窝。
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来源期刊
Vacuum
Vacuum 工程技术-材料科学:综合
CiteScore
6.80
自引率
17.50%
发文量
0
审稿时长
34 days
期刊介绍: Vacuum is an international rapid publications journal with a focus on short communication. All papers are peer-reviewed, with the review process for short communication geared towards very fast turnaround times. The journal also published full research papers, thematic issues and selected papers from leading conferences. A report in Vacuum should represent a major advance in an area that involves a controlled environment at pressures of one atmosphere or below. The scope of the journal includes: 1. Vacuum; original developments in vacuum pumping and instrumentation, vacuum measurement, vacuum gas dynamics, gas-surface interactions, surface treatment for UHV applications and low outgassing, vacuum melting, sintering, and vacuum metrology. Technology and solutions for large-scale facilities (e.g., particle accelerators and fusion devices). New instrumentation ( e.g., detectors and electron microscopes). 2. Plasma science; advances in PVD, CVD, plasma-assisted CVD, ion sources, deposition processes and analysis. 3. Surface science; surface engineering, surface chemistry, surface analysis, crystal growth, ion-surface interactions and etching, nanometer-scale processing, surface modification. 4. Materials science; novel functional or structural materials. Metals, ceramics, and polymers. Experiments, simulations, and modelling for understanding structure-property relationships. Thin films and coatings. Nanostructures and ion implantation.
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