Differentiated fracture behaviors of a spray-formed Al-Cu-Li alloy under various heat treatments at liquid nitrogen temperature

IF 2.1 3区 工程技术 Q3 PHYSICS, APPLIED Cryogenics Pub Date : 2025-04-15 Epub Date: 2025-02-23 DOI:10.1016/j.cryogenics.2025.104049
Shiyi Wen , Wangjun Cheng , Yue Zhao , Yaoning Sun
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Abstract

An experimental study was conducted on the tensile and fracture behaviors of a spray-formed Al-Cu-Li alloy at liquid nitrogen (LN2) temperature. The mechanical properties and fracture morphology of the spray-formed, solution-treated and aged Al-Cu-Li alloy sheets at ambient temperature (AT) and −196 °C were discussed in detail. The tensile fracture behaviors at low temperature were revealed. It is illustrated that the stress gradient and limit strain at −196 °C are relatively larger due to a significant strengthening and plasticizing effect. The solution-treated and aged alloys present a large resistance to the plastic deformation and fracture at LN2 temperature. The ductility of the aged alloy is insensitive to the LN2 temperature. Compared to the aged alloy, the solution-treated alloy is more favorable for the forming and manufacture of complex-shaped Al-Cu-Li alloy components at low temperature of LN2.

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喷射成形Al-Cu-Li合金在液氮温度下不同热处理的断裂行为差异
对喷射成形Al-Cu-Li合金在液氮温度下的拉伸和断裂行为进行了实验研究。详细讨论了喷涂成形、固溶处理和时效铝铜锂合金板材在常温和- 196℃下的力学性能和断口形貌。揭示了低温拉伸断裂行为。结果表明,在- 196℃时,由于强化和塑化作用明显,应力梯度和极限应变相对较大。固溶处理和时效处理的合金在LN2温度下具有较强的抗塑性变形和抗断裂能力。时效合金的延展性对LN2温度不敏感。与时效合金相比,固溶处理合金更有利于在低温LN2下形成和制造复杂形状的Al-Cu-Li合金部件。
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来源期刊
Cryogenics
Cryogenics 物理-热力学
CiteScore
3.80
自引率
9.50%
发文量
0
审稿时长
2.1 months
期刊介绍: Cryogenics is the world''s leading journal focusing on all aspects of cryoengineering and cryogenics. Papers published in Cryogenics cover a wide variety of subjects in low temperature engineering and research. Among the areas covered are: - Applications of superconductivity: magnets, electronics, devices - Superconductors and their properties - Properties of materials: metals, alloys, composites, polymers, insulations - New applications of cryogenic technology to processes, devices, machinery - Refrigeration and liquefaction technology - Thermodynamics - Fluid properties and fluid mechanics - Heat transfer - Thermometry and measurement science - Cryogenics in medicine - Cryoelectronics
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