V. Osipchik, Yu. V. Olikhova, L.Kh. Nguen, G. A. Lushcheĭkin, V. Aristov
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引用次数: 0
Abstract
Thermomechanical analysis, dynamic mechanical analysis, differential scanning calorimetry, and dielectric thermal analysis were used to determine the glass transition temperature of hot-curing epoxy siloxane composites. The effect of polymethylphenylsiloxane resin on the parameters of the three-dimensional structure and on the deformation and strength properties of epoxy novolac resin during curing by 4,4′-diaminodiphenylmethane was established.
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