{"title":"The Optimal Bias Current of Microbolometer under Self-Heating Effect","authors":"Chao Chen, Long Zhang, Yadong Jiang, Tao Wang","doi":"10.1109/CICN.2014.37","DOIUrl":null,"url":null,"abstract":"In this paper, a three-level model of micro bolometer was established by intellisuit software. The total heat capacity, resistance and device thermal conductance Gdev (lower limit) was obtained by theoretical calculation, resistance extraction and dynamic thermal finite element simulation respectively. According to the relationship among of the bias current, effective thermal conductance and device thermal conductance, the range of current is got. Different current and the same amount of heat radiation were loaded on the devices for dynamic thermoelectric coupling finite element simulation. Considering the thermal time constant, effective thermal conductance and power consumption, the optimal current can be drawn.","PeriodicalId":6487,"journal":{"name":"2014 International Conference on Computational Intelligence and Communication Networks","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2014-11-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2014 International Conference on Computational Intelligence and Communication Networks","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CICN.2014.37","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, a three-level model of micro bolometer was established by intellisuit software. The total heat capacity, resistance and device thermal conductance Gdev (lower limit) was obtained by theoretical calculation, resistance extraction and dynamic thermal finite element simulation respectively. According to the relationship among of the bias current, effective thermal conductance and device thermal conductance, the range of current is got. Different current and the same amount of heat radiation were loaded on the devices for dynamic thermoelectric coupling finite element simulation. Considering the thermal time constant, effective thermal conductance and power consumption, the optimal current can be drawn.
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