半结晶金属超分子聚合物网络的塑化

IF 4.7 Q1 POLYMER SCIENCE ACS polymers Au Pub Date : 2022-11-09 DOI:10.1021/acspolymersau.2c00044
Franziska Marx, Subhajit Pal, Julien Sautaux, Nazim Pallab, Grégory Stoclet, Christoph Weder* and Stephen Schrettl*, 
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引用次数: 0

摘要

配体官能化(宏观)单体与合适的金属离子的组装提供了金属超分子聚合物(MSPs)。由于金属-配体复合物的可逆性和动态性,这些材料可以在暴露于适当的刺激下暂时(分解)组装,这种效应可以用于修复受损样品,促进加工和回收,或实现可逆粘附。我们在这里报道了半结晶、刺激响应性MSP网络的塑化,该网络是通过将携带三个2,6-双(1′-甲基苯并咪唑基)吡啶(Mebip)配体和双(三氟甲基磺酰基)酰亚胺锌(Zn(NTf2)2)的低分子量构建块组合而成的。原始材料表现出高熔点(Tm=230°C)和玻璃化转变(Tg≈157°C)温度,并在这些温度之间提供强大的机械性能。我们表明,这种制度可以通过塑化得到实质性的扩展。为此,将MSP网络与邻苯二甲酸二异癸酯共混。系统地改变了这种增塑剂的重量分数,并研究了所得材料的热性能和机械性能。我们发现Tg可以降低60°C以上,并且Tg以上的韧性显著提高。
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Plasticization of a Semicrystalline Metallosupramolecular Polymer Network

The assembly of ligand-functionalized (macro)monomers with suitable metal ions affords metallosupramolecular polymers (MSPs). On account of the reversible and dynamic nature of the metal–ligand complexes, these materials can be temporarily (dis-)assembled upon exposure to a suitable stimulus, and this effect can be exploited to heal damaged samples, to facilitate processing and recycling, or to enable reversible adhesion. We here report on the plasticization of a semicrystalline, stimuli-responsive MSP network that was assembled by combining a low-molecular-weight building block carrying three 2,6-bis(1′-methylbenzimidazolyl) pyridine (Mebip) ligands and zinc bis(trifluoromethylsulfonyl)imide (Zn(NTf2)2). The pristine material exhibits high melting (Tm = 230 °C) and glass transition (Tg ≈ 157 °C) temperatures and offers robust mechanical properties between these temperatures. We show that this regime can be substantially extended through plasticization. To achieve this, the MSP network was blended with diisodecyl phthalate. The weight fraction of this plasticizer was systematically varied, and the thermal and mechanical properties of the resulting materials were investigated. We show that the Tg can be lowered by more than 60 °C and the toughness above the Tg is considerably increased.

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