复合磁性材料制备薄膜v型槽电感器

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426) Pub Date : 2000-07-14 DOI:10.1109/IWIPP.2000.885191

S. Prabhakaran, D.E. Kreider, Yu Lin, C. Sullivan, C. Levey

{"title":"复合磁性材料制备薄膜v型槽电感器","authors":"S. Prabhakaran, D.E. Kreider, Yu Lin, C. Sullivan, C. Levey","doi":"10.1109/IWIPP.2000.885191","DOIUrl":null,"url":null,"abstract":"A new fabrication process is described for high performance embedded or integrated inductors for power converters. The process includes etching V-grooves in a silicon substrate, depositing granular composite magnetic materials, and electroplating the copper conductors.","PeriodicalId":359131,"journal":{"name":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","volume":"173 2","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2000-07-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":"{\"title\":\"Fabrication of thin-film V-groove inductors using composite magnetic materials\",\"authors\":\"S. Prabhakaran, D.E. Kreider, Yu Lin, C. Sullivan, C. Levey\",\"doi\":\"10.1109/IWIPP.2000.885191\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A new fabrication process is described for high performance embedded or integrated inductors for power converters. The process includes etching V-grooves in a silicon substrate, depositing granular composite magnetic materials, and electroplating the copper conductors.\",\"PeriodicalId\":359131,\"journal\":{\"name\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"volume\":\"173 2\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2000-07-14\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"17\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IWIPP.2000.885191\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IWIPP.2000.885191","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 17

摘要

介绍了一种用于功率变换器的高性能嵌入式或集成电感的新工艺。该工艺包括在硅衬底上蚀刻v型槽、沉积颗粒状复合磁性材料和电镀铜导体。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Fabrication of thin-film V-groove inductors using composite magnetic materials

A new fabrication process is described for high performance embedded or integrated inductors for power converters. The process includes etching V-grooves in a silicon substrate, depositing granular composite magnetic materials, and electroplating the copper conductors.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

IWIPP 2000. International Workshop on Integrated Power Packaging (Cat. No.00EX426)

自引率

0.00%

发文量

期刊最新文献

Fabrication of thin-film V-groove inductors using composite magnetic materials Polymer thick film (PTF) and flex technologies for low cost power electronics packaging Power supply arcing Low stress anhydride molding compound for RF applications An integrated architectural framework for power conversion systems