在LT42/硅衬底上降低TCF的漏形SAW

Haixia Wang, T. Baron, G. Martin, W. Daniau, M. Pijolat, J. Brice, E. Courjon, S. Ballandras
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引用次数: 0

摘要

本文致力于降低(YXl)/42°钽酸锂上漏面声波(LSAW)的频率温度系数(TCF)。基于LiTaO3晶圆的复合单晶衬底结合到硅上,并减薄到几十μm。主要思想是利用硅限胀来阻碍钽酸盐的自然热膨胀。在这些复合晶圆上建立了2ghz谐振器来演示该原理。温控尖端探测试验表明,沟槽内绝对TCF小于7 pm。一套具有代表性的谐振器已被封装并在气候室中进行了测试,结果表明TCF比单晶衬底的TCF小得多,并且温度补偿均匀。最后讨论了本研究的展望和进一步发展。
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Leaky SAW with reduced TCF on LT42/Silicon substrates
This work is devoted to the reduction of temperature coefficient of frequency (TCF) of leaky-surface-acoustic-wave (LSAW) on (YXl)/42° Lithium Tantalate. Compound single crystal substrates based on LiTaO3 wafers bonded onto Silicon and thinned down to some tens μm are manufactured in that way. The leading idea consists in impeding the natural Tantalate thermal expansion using Silicon limited expansion. 2 GHz resonators have been built on these compound wafers to demonstrate the principle. Temperature-controlled tip-probing tests show on-trench absolute TCF smaller than 7 pmm.K-1. A representative set of resonator has been packaged and tested in a climatic chamber, yielding evidence of TCF much smaller than the one of the single-crystal substrate and even temperature compensation. Perspective and further developments of this work are discussed as a conclusion.
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