高性能有机衬底，具有高介电常数，低损耗和低谐振频率温度系数，适用于高频射频模块应用

2011 IEEE Radio and Wireless Symposium Pub Date : 2011-03-07 DOI:10.1109/RWS.2011.5725446

Kiyoshige Kojima, Naomi Shiga, T. Matsuo, R. Mori, Y. Hayashi, Mitsushi Tada, T. Jimbo

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引用次数: 0

摘要

在本文中，我们提出了一种用于射频模块和高频器件的薄有机树脂基板材料(称为X-R)，它具有非常低的插入损耗特性。X-R材料具有与LTCC相同的介电常数(Dk=7.0)和相同的损耗(Df=0.003)，并且具有较低的TCF(谐振频率温度系数)(1GHz时为5.9ppm/℃)。我们已经证明，基于X-R的嵌入式带通滤波器具有非常低的插入损耗(S21)性能，这对于射频模块和高频器件是有希望的

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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High performance organic substrate with high dielectric constant, low loss, and low temperature coefficient of resonant frequency for high frequency RF module applications

In this paper we present a thin organic resin substrate material (called X-R) for RF modules and high frequency devices, which has a very low insertion loss property. The X-R material possesses the same dielectric constant (Dk=7.0) and the same loss (Df=0.003) as LTCC, and shows low TCF (temperature coefficient of resonant frequency) (5.9ppm/deg.C at 1GHz). We have proven that embedded band-pass filter based on the X-R shows very low insertion loss (S21) performance, which is promising for RF modules and high frequency devices

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2011 IEEE Radio and Wireless Symposium

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