玻璃中间层集成了毫米波天线，用于芯片间/芯片内通信

2015 International Workshop on Antenna Technology (iWAT) Pub Date : 2015-03-04 DOI:10.1109/IWAT.2015.7365312

Y. Yoon, Seahee Hwangbo, Arian Rahimi, Sheng-Po Fang, T. Schumann

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引用次数: 1

摘要

毫米波天线集成在玻璃中间层中，用于无线芯片间/芯片内/板间通信。对于平面内通信，设计了具有全向辐射方向图的圆盘加载单极子天线;对于平面外通信，配置了具有贴片模式辐射的类似结构。这些天线可用于封装三维集成系统的无线互连。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Glass interposer integrated millimeter wave antennas for inter-/intra chip communications

Millimeter wave antennas are integrated in the glass interposer layer for wireless inter-/intra chip/board communications. For in-plane communication, a disc loaded monopole antenna with an omni-directional radiation pattern is designed while for out-of plane communication, a similar architecture with patch mode radiation is configured. These antennas are useful for wireless interconnects in three dimensional integrated systems in package.

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2015 International Workshop on Antenna Technology (iWAT)

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