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引用次数: 6

摘要

在不久的将来,手持无线电和无线通信系统将成为一个大容量的市场。讨论了GaAs如何成为该应用的关键技术,以及如何利用可以从硅加工中获得的专业知识。这些新兴应用的支持因素是成本、尺寸、重量、功能和高工作频率。比较了砷化镓和硅制程技术。考虑了硅工艺和制造技术向砷化镓的转移。讨论了GaAs单片微波集成电路
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MMIC consumer application and production
Hand-held radios and wireless telecommunication systems will represent in the near future a high volume market. How GaAs can become a key technology for this application and how to leverage the expertise that can be obtained from silicon processing are discussed. The enabling factors of these emerging applications are cost, size, weight, features, and high operating frequency. GaAs and silicon process technologies are compared. The transfer of silicon process and manufacturing technology to GaAs is considered. GaAs monolithic microwave integrated circuits are discussed.<>
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