{"title":"eeprom的现状、未来与标准化","authors":"A. Lancaster, P. Salsbury","doi":"10.1109/ISSCC.1984.1156612","DOIUrl":null,"url":null,"abstract":"Large bit density EEPROMs are becoming available from multiple vendors. The structures of these devices are based on many diverse technologies, and provide many different features. Potential users are faced with many difficult choices. Panelists will discuss this profileration of approaches, the relative merits of each and address the standardization problem.","PeriodicalId":260117,"journal":{"name":"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Status, future and standardization of EEPROMs\",\"authors\":\"A. Lancaster, P. Salsbury\",\"doi\":\"10.1109/ISSCC.1984.1156612\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Large bit density EEPROMs are becoming available from multiple vendors. The structures of these devices are based on many diverse technologies, and provide many different features. Potential users are faced with many difficult choices. Panelists will discuss this profileration of approaches, the relative merits of each and address the standardization problem.\",\"PeriodicalId\":260117,\"journal\":{\"name\":\"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"volume\":\"14 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISSCC.1984.1156612\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1984 IEEE International Solid-State Circuits Conference. Digest of Technical Papers","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISSCC.1984.1156612","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Large bit density EEPROMs are becoming available from multiple vendors. The structures of these devices are based on many diverse technologies, and provide many different features. Potential users are faced with many difficult choices. Panelists will discuss this profileration of approaches, the relative merits of each and address the standardization problem.
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