用于多波段模块的低姿态宽带核心隔离器

T. Wada, T. Hasegawa, M. Koshino, T. Okada
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引用次数: 1

摘要

成功研制了一种适用于多标准、多频段手机模块的新型宽带核心隔离器。提出了一种新的扩展隔离频带的电路结构。从等效电路出发,利用微扰理论推导了具有谐振元件的双端口隔离器的插入损耗和隔离带宽方程。结果表明,在不增加插入损耗的情况下,隔离带宽随电感与谐振元件电容比例的增加而增大。制作了一种1.5 × 0.9 × 0.4 mm3的非对称电极芯隔离器,并将其安装在具有谐振元件的模块基板上。它的插入损耗为0.5dB,在824-915MHz的隔离度为10dB,比传统的宽两倍。
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Low-profile broadband Core-Isolator for multi-band module
A novel broadband Core-Isolator for modules of multi-standard and multi-band mobile handsets has been developed successfully. A new circuit configuration for extending the isolation frequency band is proposed. The equations of the insertion loss and the isolation bandwidth of a two-port isolator with resonant elements are derived from equivalent circuit using perturbation theory. They show that the isolation bandwidth gets wider depending on the ratio of inductor and capacitor of resonant elements without increasing the insertion loss. A 1.5 × 0.9 × 0.4 mm3 Core-Isolator with two electrodes of asymmetrical structure has been fabricated, which is mounted on a module substrate with resonant elements. It has an insertion loss of 0.5dB and an isolation of 10dB at 824–915MHz which is twice wider than conventional one.
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