FDDI物理层芯片对Playthrough协议的适配

F.R. Steinberg, C. B. Silio
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引用次数: 0

摘要

提出了一种支持在环形拓扑局域网中使用Playthrough协议的物理层编码器/解码器(ENDEC)芯片的数据流设计和超高速集成电路(VHSIC)硬件描述语言(VHDL)行为仿真。作者描述了Playthrough协议的操作概念。ENDEC设计尽可能多地使用光纤分布式数据接口(FDDI)标准,在光纤介质上支持100 mb /s的数据传输速率,该芯片与Advanced Micro Devices (AMD) FDDI ENDEC芯片兼容。本设计采用了一种适应AMD FDDI的ENDEC数据流结构;但是,由于Playthrough媒体访问控制(MAC)协议与FDDI协议不同,因此需要新的控制流结构和不同的内部结构来适应Playthrough MAC (PMAC)芯片功能。
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Adaptation of FDDI physical layer chip to Playthrough protocol
Data flow design and very-high-speed integrated circuit (VHSIC) hardware description language (VHDL) behavioral simulation are presented for a physical layer encoder/decoder (ENDEC) chip that supports use of a Playthrough protocol on ring topology local area networks. The authors describe the Playthrough protocol's operational concept. The ENDEC design uses as much of the fiber distributed data interface (FDDI) standard as possible to support a 100-Mb/s data transfer rate on fiber-optic media with a chip that is plug compatible with the Advanced Micro Devices (AMD) FDDI ENDEC chip. The design uses an adaptation of the AMD FDDI ENDEC data flow structure; however, because the Playthrough media access control (MAC) protocol differs from FDDI's, a new control flow structure and a different internal structure are required to accommodate Playthrough MAC (PMAC) chip functions.<>
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