光纤互连集成在FR4板与MSM光电探测器和商用光电器件

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338681

Z. Huang, D. Guidotti, G. Chang, J. Liu, F. Liu, Y. Chang, R. Tummala

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引用次数: 1

摘要

本文概述了一种将商用裸模VCSEL和PiN PDs嵌入聚合物波导的集成工艺，该工艺嵌入在廉价的印刷线路板(PWB)板上。测量了硅氧烷波导中PiN和金属-半导体-金属(MSM) PD的倏逝耦合效率。这是首次演示将商业PiN - pd嵌入聚合物波导中用于高速芯片到芯片光学互连的过程。FR4板硅氧烷波导内嵌式光电器件，如波导内嵌MSM PD、波导内嵌PiN PD、波导内嵌VCSEL、板上嵌PiN、端镜波导内嵌VCSEL等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Optical interconnects integration on FR4 board with MSM photodetector and commercial optoelectronic devices

In this paper, a process is outlined for the integration of commercial bare die VCSEL and PiN PDs embedded in polymer waveguide on inexpensive printed wiring board (PWB) boards. The evanescent coupling efficiency of both PiN and metal-semiconductor-metal (MSM) PD from Siloxane waveguide is measured. This is the first demonstration of a process for embedding commercial PiN PDs in polymer waveguide for high speed chip to chip optical interconnects. Optoelectronic devices embedded in Siloxane waveguide on FR4 board such as embedded MSM PD in waveguide, PiN PD embedded in waveguide, embedded VCSEL and PiN on board and embedded VCSEL in waveguide with end mirror.

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Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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