利用海航技术制备固体微针阵列的研究

2006 IEEE International Conference on Semiconductor Electronics Pub Date : 2006-11-01 DOI:10.1109/SMELEC.2006.381012

N. A. Aziz, B. Majlis

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引用次数: 5

摘要

本文提出了一种面外硅微针阵列的工艺开发方法。本研究利用湿法刻蚀技术，利用HNA构建了尖尖微针结构;biconvex-conical形状。制备的微针高度为41.8微米，针尖半径为1.4微米。对不同的掩模开启窗的效果进行了研究。设计方法和制造过程在这里有很好的解释。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Fabrication Study of Solid Microneedles Array Using HNA

This paper presents an approach for the process development of the out of plane silicon microneedles array fabrication. This study utilizes the wet etching technology using HNA to build a structure of sharp-tipped microneedles; biconvex-conical shaped. The height of the fabricated microneedle is 41.8 mum and the tip radii is 1.4 mum. Investigation on the effect of varying the mask opening window had been carried out. The design approach and the fabrication process are well explained here.

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2006 IEEE International Conference on Semiconductor Electronics

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