多耦合线键互连的新型建模方法

I. Doerr, G. Sommer, H. Reichl
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引用次数: 7

摘要

提出了一种频率高达10GHz的多耦合线键电建模新方法。本文描述了一种非常简单的方法来获得复杂结构如多重耦合导线键的复杂电模型。利用优化算法进行电磁场计算和紧凑模型提取,只局限于少数元素。一种非常有效的方法是从开发单线键的等效电路模型开始。采用单个互连的电学模型对耦合互连进行建模。采用全波电磁场计算方法计算s参数。s参数非常适合于提取射频(RF)的紧凑模型。此外,通过对设计套件和库使用参数化模型,该过程仍然更有效。
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A novel modeling approach for multiple coupled wire bond interconnects
A novel approach for electrical modeling of multiple coupled wire bonds up to a frequency of 10GHz is presented. This paper describes a very easy way to get complex electrical model for complex structures like multiple coupled wire bonds. Electromagnetic field computation and compact model extraction using optimization algorithm is limited on few elements. A very efficient way is starting with the development of an equivalent circuit model for a single wire bond. The electrical model of single interconnect is used to model coupled interconnects. Full wave electromagnetic field computation was used to calculate the S-parameters. S-parameters are very good suitable to extract compact models for radio frequencies (RF). Moreover, this procedure is still more effectively by using parameterized models for design kits and libraries.
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Presentation of a new time domain simulation tool and application to the analysis of advanced interconnect performance dependence on design and process parameters Sensitivity analysis of generic on-chip /spl Delta/I-noise simulation methodology A frequency domain approach for efficient model reduction of mixed VLSI circuits Non-uniform grid (NG) algorithm for fast capacitance extraction Dampening high frequency noise in high performance microprocessor packaging
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