60GHz MIMO雷达封装概念的发展

C. Tschoban, S. Dilek, I. Ndip, H. Pötter, K. Lang, M. Schneider-Ramelow
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摘要

非接触式界面技术将在未来的电子系统中得到越来越多的应用。本文描述了一种用于这种接口的新型传感器元件的开发。在这项工作中,我们应用了一种系统的方法,即m3方法(方法,模型,测量),来设计小型化,可扩展和低成本的60 GHz MIMO(多输入多输出)雷达前端,用于将新型非触摸人机界面集成到表格中。该雷达模块开发采用的封装技术适合量产。全面应用m3方法需要执行三个关键步骤,即方法、模型和措施。然而,在本文中,我们将重点关注前两个步骤(即方法和模型),并详细描述这些步骤。
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Development of a 60GHz MIMO Radar Packaging Concept
Non-touch interface technology will be used more and more in future electronic systems. This paper describes the development of a novel sensor element for such interfaces. In this work, we apply a systematic approach, the M3-approach (methodologies, models, measures), to design miniaturized, scalable and low-cost 60 GHz MIMO (Multiple Input Multiple Output) radar front-ends for the integration of a novel non-touch human interface into a table. The packaging technology applied for the development of this radar module is suitable for mass production. The complete application of the M3-approach requires the implementation of three key steps, namely methodologies, models and measures. However, in this paper, we focus on the first two steps (i.e., methodologies and models) and describe these steps in detail.
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