导电带在电流老化过程中的可靠性比较

M. Hirman, J. Navrátil, F. Steiner, A. Hamácek
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引用次数: 1

摘要

本文研究了导电纺织带的焊接/胶合接头在电流老化过程中的可靠性。锡铋锡膏通过热风手工焊接实现了焊接。采用紫外光固化不导电胶粘剂进行粘接。在电流负荷前、负荷中、负荷后,焊/粘接头的电阻均令人满意。该实验证明,将SMD芯片组件焊接/粘接到导电纺织带上是可能的,并且这些接头在电流负载下仍然可用。因此,经过测试的带状接头类型可以推荐供将来使用。
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Comparison of Conductive Ribbons Reliability during Electrical Current Ageing
This paper deals with reliability of soldered/glued joints on electrically conductive textile ribbons during the electrical current ageing. The soldering was realized with tin-bismuth solder paste by hand soldering with hot air. The gluing was realized by UV curable non-conductive adhesive. The electrical resistance of soldered/glued joints on ribbons before, during and after electrical current load was satisfactory. The experiment provided proof that soldered/glued SMD chip components onto electrically conductive textile ribbons is possible and these joints are still usable under the electrical current load. It follows that tested types of joints on ribbon can be recommended for future use.
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