A Design and Implementation of Busbar Joint and Temperature Measurement System

In general, distribution board, panel board and motor control center can be installed over a wide area such as residence of group, building, schools, factories, ports, airports, water service and sewerage, substation and heavy industries that are used to supply converts the voltages extra high voltage into optimal voltage. There are electrical accidents due to rise of contact temperature, loose contact between busbar, deterioration of the contact resistance, over temperature of the busbars. In this paper, we designed and implemented the busbar joint and temperature measurement system, which can measure the joint resistance of busbar and loose connection between busbar using potentiometer and non-contact infrared sensor. The experimental results show that tightening the bolt and nut is fully engaged, resistance was decreased and maximum error range was 0.1mm. Also, the experimental result showed that the temperature at the contact area is increased from 27.3°C to 69.3°Cby the contact resistance. 키워드 : 부스바, 배전반, 분전반, 전동기제어반, 체결상태 모니터링 Key word : Busbar, distribution board, panel board, motor control center, busbar joint monitoring Received 08 November 2016, Revised 11 November 2016, Accepted 23 December 2016 * Corresponding Author Young-Dong Lee(E-mail:ydlee@cs.ac.kr, Tel:+82-55-250-1312) Department of Computer Software Engineering, Changshin University, Changwon 51352, Korea Open Access http://doi.org/10.6109/jkiice.2017.21.2.379 print ISSN: 2234-4772 online ISSN: 2288-4165 This is an Open Access article distributed under the terms of the Creative Commons Attribution Non-Commercial License(http://creativecommons.org/li-censes/ by-nc/3.0/) which permits unrestricted non-commercial use, distribution, and reproduction in any medium, provided the original work is properly cited. Copyright C The Korea Institute of Information and Communication Engineering. Journal of the Korea Institute of Information and Communication Engineering 한국정보통신학회논문지(J. Korea Inst. Inf. Commun. Eng.) Vol. 21, No. 2 : 379~385 Feb. 2017